business

India’s First Advanced 3D Chip Packaging Unit Launched in Odisha, Boosting AI and Semiconductor Ambitions

By Neel Achary

Bhubaneswar, April 19 (BNP): In a major step towards strengthening India’s semiconductor ecosystem, the foundation stone for the country’s first advanced 3D semiconductor packaging unit was laid at Info Valley in Bhubaneswar on Saturday. The project, promoted by 3D Glass Solutions , marks a significant milestone in India’s push for self-reliance in high-end electronics manufacturing under the vision of Narendra...